Polymer Engineering Faculty Research

Title

Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive

Document Type

Article

Publication Date

2005

Abstract

Conductive adhesives have been used in a variety of electronic packaging applications. This paper presents an investigation into the effects of various adherend surface treatments on the fatigue and failure behaviors of adhesively-bonded joints. For this purpose, single-lap joints were fabricated using specimens with adherend surfaces modified employing various chemical and mechanical modification techniques, and tested under a spectrum of fatigue and environmental conditions. The results of our work indicate a profound influence of the adherend surface on both the fatigue behavior and also the moisture ingress mechanism into the joint. Finally, experiments were conducted to assess the effect of adherend surface condition on the moisture ingress mechanism.

Publication Title

Journal of Adhesion Science and Technology

Volume

19

Issue

8

First Page

659

Last Page

678

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