Mechanical Engineering Faculty Research

Title

Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials

Document Type

Article

Publication Date

Spring 4-2003

Abstract

Significant melt undercooling may be developed in the melt in front of the solid/liquid interface during solidification of semitransparent materials because of internal radiative heat transfer with the environment. A nonequilibrium plana interface solidification model has been developed recently to permit the melt undercooling near the interface. A thermal analysis is presented for the stability of such a planar interface. . .

Publication Title

Journal of Thermophysics and Heat Transfer

Volume

17

Issue

2

First Page

193

Last Page

198

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