Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials
Significant melt undercooling may be developed in the melt in front of the solid/liquid interface during solidification of semitransparent materials because of internal radiative heat transfer with the environment. A nonequilibrium plana interface solidification model has been developed recently to permit the melt undercooling near the interface. A thermal analysis is presented for the stability of such a planar interface. . .
Journal of Thermophysics and Heat Transfer
Wang, Guo-Xiang; Yao, Chengcai; and Chung, Benjamin T.F., "Thermal Analysis on Planar Interface Stability in Solidification of Semitransparent Materials" (2003). Mechanical Engineering Faculty Research. 955.