Polymer Engineering Faculty Research

Conduction efficiency and strength of electronically conductive adhesive joints

Erol Sancaktar, The University of Akron


Electronically conductive adhesives are being considered as an alternative to solder for interconnection in microelectronics. In order to gain insight regarding electrical and mechanical performance properties of this class of adhesive interconnections, overlap joints were made. Joint resistance and mechanical bond strength were measured before and after environmental stressing.