Polymer Engineering Faculty Research
Reply to Comment on Linking Cure Process to Adhesive Bulk Strength by Differential Thermal Analysis
Abstract
A Comment published in this issue and authored by B. C. Ennis refers extensively to one of our earlier papers entitled “Linking Cure Process to Adhesive Bulk Strength by Differential Thermal Analysis.” We are delighted to see that our work can capture the attention of scientists working in this area and stimulate them to write lengthy reviews. At the same time, however, we feel that this particular note, in various discussions, misinterprets our paper, and does not seem to contribute any new or substantial scientific information to the literature.
This paper has been withdrawn.