Polymer Engineering Faculty Research
Linking Cure Process to Adhesive Bulk Strength by Differential Thermal Analysis
Abstract
A first order kinetic reaction model is utilized to model the cure process of epoxy adhesive Metlbond 1113. Actual states of full cure corresponding to a spectrum of cure temperature-time schedules are identified using the DTA method. Comparison of these experimental results with the corresponding theoretical predictions reveals that the first order kinetic reaction model provides accurate prediction of full cure when low temperature-long time schedules in close proximity to Tg are used. These cure schedules also result in the highest adhesive bulk tensile strength.
This paper has been withdrawn.