Polymer Engineering Faculty Research

Title

Geometric effects on multilayer generic circuits fabricated using conductive epoxy/nickel adhesives

Document Type

Article

Publication Date

2008

Abstract

Epoxy/nickel adhesives can be used as integrated circuit (IC) packaging materials due to their lower cost than epoxy/silver adhesives with acceptable electrical conductivity. In this work, conductive epoxy/Ni adhesives were prepared by the solution method and filled into holes connecting the multilayers of a novel prototype designed for use in electronic components in circuit boards, in order to study the geometric effects on the prototype's electrical resistance. An empirical equation was obtained for the contact resistance (R c) measured after cure. We also show that Ohm's law adequately describes the effects of the bulk adhesive resistance (R b) on prototype's electrical resistance.

Publication Title

Journal of Adhesion Science and Technology

Volume

22

Issue

8-9

First Page

947

Last Page

956

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