Mechanical Engineering Faculty Research

Title

Synthesis and Characterization of Nano-Composite Lead-Free Solder

Document Type

Article

Publication Date

Winter 1-2005

Abstract

A series of experiments conducted on a lead-free eutectic solder (Sn-3.5%Ag) have shown that addition of trace amounts of nanometer-sized particles does have an influence on mechanical properties of materials. In this study, three different types of nanoparticles (copper, nickel and iron) were chosen as the reinforcing candidate. For each particulate reinforcement the reflow process was performed under identical cooling conditions. Addition of trace amounts of nano-particles alters the kinetics governing solidification of the composite solder paste while concurrently exerting an influence on microstructural development, particularly the formation and presence of second phases in the solidified end product. The nano-sized powder particle-reinforced composite solder revealed an increase in microhardness compared to the unreinforced monolithic counterpart.

Publication Title

Journal of Metastable and Nanocrystalline Materials

Volume

23

Issue

1

First Page

145

Last Page

150

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