Polymer Engineering Faculty Research

Title

Pressure-dependent conduction behavior of various particles for conductive adhesive applications

Document Type

Article

Publication Date

1999

Abstract

The efficiency of electric conduction in particle filled conductive adhesives largely depends on the interparticle conduction. In order to gain insight into the pressure dependent conduction behavior with particles of different size, shape and type, the effects of external pressure on the filler resistance were measured by the four-point probe method using different conductive fillers. The following types of particles were used: Ni powder, Ni flake, Ag powder, Ni filament, magnetite (Fe3O4) spindles, and Cu particles. Nonfilament particle size was in the 0.7-44 μm range. The filaments were 20 μm in diameter, and 160 or 260 μm in length. Particle treatment procedures assessed included silver coating using different methods, and the use of acid solutions including H3PO4, HF, and HCl to remove the surface oxide layer. Resistivity levels were measured using a nonconductive hollow cylinder plunger device developed in the authors' laboratories

Publication Title

Journal of Adhesion Science and Technology

Volume

13

Issue

6

First Page

679

Last Page

693

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