Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure
Epoxy/nickel adhesives can be used as integrated circuit (IC) packaging material due to their lower cost than epoxy/silver adhesives with acceptable electrical conductivity. In this work, chemorheological behaviors of Epon 830/Ni/diethylenetriamine (DETA) adhesives were investigated during processing and cure, as a function of shear rate, resin conversion, Ni volume fraction and temperature. A strongly nonlinear characteristic of filled epoxy/Ni systems was revealed, and a steady shear had to be employed for chemorheological analyses. A strongly non-Newtonian flow behavior was observed for epoxy/Ni adhesives also during cure. The power-law model, Castro–Macosko model, Liu model and the Arrhenius model adequately describe, respectively, the effects of shear rate, resin conversion, filler volume fraction and temperature on chemoviscosity. A comprehensive model combining these individual models predicts the isothermal chemoviscosity data well and the nonisothermal data reasonably. A modified comprehensive model was also proposed in this work to improve the model fit to nonisothermal experimental data.
Journal of Adhesion Science and Technology
Zhou, Jianguo and Sancaktar, Erol, "Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure" (2008). Polymer Engineering Faculty Research. 1431.