Polymer Engineering Faculty Research
Electronically Conductive Adhesives: Conduction Mechanisms, Mechanical Behavior and Durability
Abstract
The objective of this research is to provide a fundamental understanding of the conduction mechanisms for electrically conductive adhesives and their applications. This research involves two parts: (a) analysis on mechanical behavior and, (b) analysis on electrical behavior of conductive adhesives. Electrical and mechanical behaviors of both bulk conductive adhesives and single lap joints bonded with a conductive adhesive are studied.
This paper has been withdrawn.